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Shenzhen KHJ Technology Co., Ltd
Manufacturer of semiconductor adhesive film solutions
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2mil ESD PI Masking Polyimide Heat Resistant Tape For Printed Circuit Boards

Shenzhen KHJ Technology Co., Ltd
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2mil ESD PI Masking Polyimide Heat Resistant Tape For Printed Circuit Boards

Brand Name : KHJ

Model Number : E1-IH803

Certification : RoHS

Place of Origin : Guangdong, China

MOQ : 1pcs

Price : Negotiable

Payment Terms : L/C, T/T

Supply Ability : 10000 square meters/day

Delivery Time : 3~5days after payment done

Packaging Details : Plastic bag +carton

Product Name : E1-IH803

Total Tape Thickness : 0.055±0.005mm

Tensile Strength at Break : ≥3.5 (KN/M)

Static Discharge (Removal from roll) : <100V

Adhesion to Steel : 4~6N/25mm

Maximum Operating Temperature : 280℃

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2mil ESD PI Masking Polyimide Heat Resistant Tape For Printed Circuit Boards

2mils ESD PI masking tape E1-IH803 polyimide heat resistant tape with super antisatic performance

E1-IH803 is a polyimide film backed silicone adhesive tape with excellent heat resistance and low static discharge properties.

Features And Benefits:

1. Low electrostatic discharge at unwind and removal.

2. Resistant high temperature up to 280℃ for 10 minutes.

3. Excellent tensile strength & Elongation.

4. RoHS Compliant.

Properties:

Item Typical Value
Imperial Metric
Backing 1.0mil 0.025mm
Total Thickness 2.2mil 0.055±0.005mm
Tack / ≥26(J.DOW/#)
Adhesion to Steel 0.91~1.37lbs/in 4~6N/25mm
Tensile Strength ≥20lbs/in ≥3.5(KN/M)
Elongation ≥45% ≥45%
Surface Resistance 106~8ohms 106~8ohms
Static Discharge (Removal from roll) <100V <100V
Maximum Operating Temperature 536℉ 280℃

Construction:

2mil ESD PI Masking Polyimide Heat Resistant Tape For Printed Circuit Boards

Application:

1. Mask for printed circuit boards during wave solder or solder dip process.

2. Masking contacts during spray painting, powder coating & solder coating.

3. Bundling of transformer, motor, battery & electronic components forinsulation purpose.

2mil ESD PI Masking Polyimide Heat Resistant Tape For Printed Circuit Boards

Storage:

1. Store under normal conditions of 10-30℃ and 40-70% R.H, out of direct sunlight.

2. Shelf life: 12 months from the date of manufacture when stored in initial packing.

Precaution Reminder:

1. Surface should be clean, dry, free of dust, oil or other contaminants.

2. Proper pressure required by roller, hand or press when applying.

3. Avoid repeat sticking to prevent adhesion decrease.

Competitive advantages of our factory:

1. Very competitive price and high quality control.

2. Timely delivery.

3. Environmentally friendly products.

4. Various designs.

Notes:

Please be advised that this technical data sheet is written based on our lab tests and experience only. Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use.


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